Startup, New York, NY – employees
Modern electronis continue to decrease in size.
Heat must be transferred out of the device in order to operate efficiently. The design challenge of cooling microelectronic components is known as thermal management.
The newest ICs are extremely difficult to cool using the technology of 1990s-2010s. The chips are tinier than ever.
PowerPeg thermal management system is the ultimate cooling solution for SMT packages. These small thermal connectors solder into the PCB, connecting directly to heat sources.
After soldering, a heatsink is bolted onto the connector. This system of interchangeable parts provides limitless possibilities.
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